Equipment
performance
This
machine is designed for cutting the wafer in solar industry and electronic
industry specially.
SYC50
adopts YAG Kr pump laser and acousto-optical modulating system, digital control
X / Y worktable, step motor for driving, moving
precisely under the control of computer, the professional control software can
make the edit and revision of program more simply and show
the motion track gradually.
SYC100
adopts the YAG Xe-pump laser for impulse, it has the characters of low repeating
frequency, narrow width of pulse, higher
density of energy. The digital control X-Y worktable can finish any track of
motion under the accurate control of computer, and it is
designed for cutting the thick wafer specially.
Applicable
fields
The
SYC50 laser cutting machine is very suitable for cutting the wafer spall of
sillicon rod.
The
SYC100 laser cutting machine is very suitable for cutting the wafer of electronic
industry.
The
main technical parameters
|
Type
specification
|
SYC50
/ SYC100
|
|
Laser
wavelength
|
1.064μm
|
|
Scriber
precision
|
≤±10μm
|
|
Max
scriber thickness
|
0.8mm
|
|
Scriber
line width
|
≤80μm
|
|
Laser
repetition frequency
|
100Hz~20kHz
|
|
Max
scriber speed
|
20mm/s
|
|
Laser
max power
|
≥50W
≥100W
|
|
Work
platform size
|
280×500mm
300×300mm
|
|
Power
supply
|
380V
/ 50Hz / 6kVA
|
|
Cooling
way
|
Circulation
water cooling
|
|
Work
platform
|
Made
professionally
|
Showroom
for samples
현재위치 : 
